Influence of Operation Parameters on Metal Deposition in Bright Nickel-plating Process

 

O. Sadiku-Agboola,^1,* E.R. Sadiku,² O.I. Ojo,¹ O.L. Akanji,¹ O.F. Biotidara²

¹ Department of Chemical Engineering, Faculty of Engineering and the Built Environment, Tshwane University of Technology, Pretoria, South Africa.

 ² Department of Mechanical Engineering, Faculty of Engineering and the Built Environment, Tshwane University of Technology, Pretoria, South Africa.

 

DOI: 10.4152/pea.201102091

 

Abstract

Bright nickel deposits were electrolytically applied on steel in the nickel Watts bath. The effect of some operational parameters on metal deposition in bright nickel plating was investigated. The investigation indicated that the weight of bright nickel deposited on metal during the process of electroplating was affected by plating temperature, voltage, current density, plating bath pH and plating time. The study established that the deposition of best bright nickel was obtained at a plating temperature of 56 ^oC, current density of 6 A/dm² and plating time of 18 minutes. Brightener is used in applications requiring outstanding appearance with minimum thickness of applied nickel plating. It can also be used for heavy deposit applications because it exhibits unparalleled ductility and low stress. Brightener was used in this study to determine the best nickel plating in the process. Boric acid was added for fixing the bath pH.  The compositions of the brightener and nickel solution used are included in the text.

Keywords: operational parameters, current density distribution, voltage, brightener and nickel deposit.

 

Full text only available in PDF format.

Texto completo disponível apenas em PDF.

 

References

1.             Q. Xu, A. Telukdarie, H.H. Lou, Y. Huang, Ind. Eng. Chem. Res. 44 (2005) 2156. 10.1021/ie0495067

2.             E. Binkauskene, Rus. J. Appl. Chem. 75 (2002) 852. 10.1023/A:1020395520503

3.             R.D. Davis, Nickel, Cobalt and their Alloys. ASM International Handbook Committe. U.S.A., 2000. p.106-107.

4.             A.O. Gezerman, B.D. Corbacioglu, Int. J. Chem. 2  (2010) 124.

5.             L. Chao-qun, L. Xin-hai, W. Zhi-xin, G. Hua-Jun, Transition Nonferrous Metals Soc. China 17 (2007) 1300.

6.             D. Golodnitsky, N.V. Gudin, G.A. Volyanuk, Journal of the Electrochemical Society 147 (2000) 4156. 10.1149/1.1394034

7.             P. Spacek, M. AngeManier, A. El Moudni, Int. J. System Sci. 30 (1999) 759. 10.1080/002077299292065

8.             V.I. Karavaev, I.L. Korobova, V. Litovka Yu, Rus. J. Appl. Chem. 79 (2006) 1840. 10.1134/S1070427206110152

9.             J. Zhang, J. Mater. Processing Tech. 123 (2002) 329. 10.1016/S0924-0136(02)00012-2        [ Links ]

10.         E. Kukharenka, M.M. Farooqui, L. Grigore, M. Kraft, N. Hollinshead, J. Micromech. Microeng. 13 (2003) S67. 10.1088/0960-1317/13/4/311

11.         Y. Kaneko, Y. Hiwatari,  K. Ohara, F. Asa, Molecular Simulation 32 (2006) 1227. 10.1080/08927020601067540

12.         M. Vidal, J.M. Amigo, R. Bro, M. Ostra, C. Ubide, Analytical Method 2 (2010) 86. 10.1039/b9ay00158a

13.         S. Lambert, Circuit World 32 (2006) 36. 10.1108/03056120610683612

14.         R. Ghanem, H. Farag, Y. Etlaweel, M.E. Ossman, Int. J. Chem. Eng. Research 1 (2009) 135.

 

* Corresponding author. E-mail address: funmi2406@gmail.com

Received 6 October 2010; accepted 27 March 2011