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Corrosão e Protecção de Materiais

Print version ISSN 0870-1164

Abstract

MARTINS, J. I.; NUNES, M. C.  and  TAVARES, P. B.. Copper electroless plating in presence of cobalt ions using hypophosphite as reductant. Corros. Prot. Mater. [online]. 2016, vol.35, n.1, pp.06-14. ISSN 0870-1164.  http://dx.doi.org/10.19228/j.cpm.2016.35.03.

The electroless copper plating using sodium hypophosphite as the reductant and sodium citrate as the chelating agent was studied by gravimetric and electrochemical measurements. The effects of temperature, pH, boric acid, citrate, hypophosphite, and cobalt catalyst concentration were evaluated. The kinetics of the electroless copper deposition was interpreted on the basis of the dehydrogenation of the reductant, mixed potential theory, and in the ionic speciation of the bath. Scanning electron microscopy, X-ray microanalysis by energy dispersive spectroscopy and X-ray diffraction applied on surfaces show that the deposits are composed by binary (Cu-Co) and ternary alloys (Cu-Co-P), and that their morphology and crystallinity depends on cobalt and phosphorus content.

Keywords : Electroless; Copper Plang; Sodium Hypophosphite; Ionic Speciaon; Copper-Cobalt Alloys.

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